Phoenix Pad Conditioners

Our patented CMP conditioners are based on a unique process of bonding diamond grit to a substrate by depositing Chemical Vapor Deposition (CVD) diamond over the grit. This process results in an all-diamond surface that provides superior diamond retention by chemically bonding the diamond grit to the substrate.

Distinctive Design

The patented CMP conditioners are based on a unique process of bonding optimally-selected diamond grit to a proprietary ceramic substrate by depositing a conformal layer of diamond over the substrate by a Chemical Vapor Deposition (CVD) process. This process results in an all-diamond surface that provides superior diamond grit retention by chemically bonding the diamond grit to the substrate. Unlike conventional conditioners, this all-diamond surface is also chemically inert to all CMP slurries, eliminating grit pullout due to corrosion or wear. In addition, the high hardness CVD diamond layer doesn’t wear down to the bare diamond crystals preventing mechanical erosion of the bond matrix.Conventional vs Diamonex bonding drawing



CMP conditioners are comprised of three basic components: diamond grit, a bond matrix, and a substrate. The material selection and method of manufacture differentiates CMP conditioners products and their resultant performance.

The Bond Matrix:

The bond matrix is used to adhere the diamond grit to the substrate surface. Conventional conditioners use metallic bonding. There are four types of metallic bonds: electroplated Nickel, electroless nickel, brazed, and sintered. One inherent weakness in all these metal bond matrices is their limited hardness, resulting in erosion. In addition, all metallic bond matrices are prone to chemical attack and corrosion by low pH slurries. In contrast, Morgan Advanced Materials is the only manufacturer that uses CVD diamond as the bond matrix. This results in superior erosion and corrosion resistance on Phoenix? conditioners.

Conventional conditioners embed the diamond grit into the bond matrix, thus limiting the diamond grit protrusion and uniformity. The Phoenix? CVD diamond bond matrix differs in that it encapsulates the diamond grit providing maximum diamond exposure for any chosen diamond grit size with remarkable uniformity.

The Substrate:

Conventional conditioners typically use a stainless steel substrate. Phoenix? conditioners use a proprietary ceramic substrate developed by us. This ceramics substrate allows improved design flexibility in shape, size, and features, while maintaining tight dimensional tolerances.

The Diamond Grit:

The Phoenix? conditioners incorporate improved diamond grit. The diamond grit selected for the Phoenix product line is a high-quality low-inclusion blocky diamond crystal material resulting in diamond crystals with the maximum fracture toughness, preventing any diamond breakage. The combination of high-strength molecular diamond bonding and high-quality diamond grit removes all possibility of wafer scratching due to diamond grit pullout or generation of diamond grit fragments

Magnified view of diamond grit

Magnified view of diamond grit particles

The Phoenix? pad conditioners have also been designed to provide the highest percentage of working grit available. Working grit is defined as the percentage of diamond grit that actually makes contact with the pad. Maintaining uniform diamond exposure and an extremely flat substrate maximises the number of 'working grit' on the surface. A high percentage of working grit provides more stable conditioner performance since the percentage of diamond grit does not change dramatically during the life of the conditioner.??

Bar graph showing percent diamond that contacts the CMP pad for various CMP conditioners

Note: Our?Diamonex? Diabond conditioners are no longer available


Extended Conditioner Life

The Phoenix? conditioner’s high working grit percentage results in longer conditioner life and more gradual decay of the pad cut rate.

Consistent Conditioner Performance

Our Diamonexl??product range utilises advanced quality control systems for raw material selection and process control to provide consistent conditioners, which results in excellent process repeatability. These features enable consistent material removal rate throughout the life of the conditioner and conditioner-to-conditioner.

Corrosion-Resistant Materials

Because the our?Diamonex? Phoenix? CMP conditioner embodies pure diamond on a ceramic substrate, it provides optimum compatibility with the wafer fabrication process, virtually eliminating chemical interactions between slurry and conditioner.

Superior Diamond Retention

The CVD diamond deposition process creates a diamond molecular bond between the CVD diamond film, the diamond grit, and the ceramic substrate. This diamond bonding minimises the possibility of grit pullout and the potential for grit-induced wafer scratches. Degradation of the bond strength from erosion and corrosion does not occur for the Phoenix conditioners because of the high hardness and the inertness of the all-diamond working surface.

Customised Designs

The Technical Ceramics business of Morgan Advanced Materials offers a variety of conditioner designs including standard 4” and 2” diameter conditioners. Designs are also available for larger diameter ring conditioners, as well as dual-sided conditioners for hard disk drive manufacturing processes.

Conditioning Disks Available

Conditioner Model Dimensions CMP Tools
?Phoenix? 2" Conditioners 2" diameter x 0.15" thick Lam Teres, IPEC 372/472?
?Phoenix? 4" Conditioners 4" diameter x 0.19" thick AMAT, IPEC 372/472, Strasbaugh, Novellus
?Phoenix? 10" Conditioners ? Ebara 200mm

Process Flexibility

Phoenix? conditioners with the all-diamond surface can be used ex-situ or in-situ in all CMP processes such as oxide, tungsten, copper, and tantalum.

For more information on our CMP pad conditioners, contact us today.

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